Invention Grant
- Patent Title: Semiconductor package with EMI shield and fabricating method thereof
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Application No.: US15404242Application Date: 2017-01-12
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Publication No.: US10553542B2Publication Date: 2020-02-04
- Inventor: Doo Soub Shin , Tae Yong Lee , Kyoung Yeon Lee , Sung Gyu Kim
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L21/48 ; H01L21/56
Abstract:
A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.
Public/Granted literature
- US20180197821A1 Semiconductor Package With EMI Shield and Fabricating Method Thereof Public/Granted day:2018-07-12
Information query
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