Invention Grant
- Patent Title: Semiconductor device, method of manufacturing semiconductor device, and antenna switch module
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Application No.: US15357361Application Date: 2016-11-21
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Publication No.: US10553550B2Publication Date: 2020-02-04
- Inventor: Yoshikazu Motoyama , Hiroki Tsunemi , Hideo Yamagata
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2012-245161 20121107
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L21/768 ; H01L23/00 ; H01P1/15 ; H01L21/762 ; H01L23/48 ; H01L29/78 ; H01L21/265 ; H01L27/12 ; H01L23/525

Abstract:
Disclosed is a semiconductor device having a radio frequency switch. Also disclosed are an antenna switch module and a method of manufacturing the semiconductor device. The semiconductor device includes a metal wiring insulating film bonded to a silicon substrate. In the semiconductor device, a crystal defect layer extends into the silicon substrate from a surface of the silicon substrate. Crystal defects are throughout the crystal defect layer. The semiconductor device and an integrated circuit are in the antenna switch module. The integrated circuit in the antenna switch module is mounted with the radio-frequency switch device and the silicon substrate. The method of manufacturing the semiconductor device includes a step of forming crystal defects throughout a silicon substrate. Radiation or a diffusion is used to form the crystal defects. After the step of forming the crystal defects, the method includes a step of implanting ions into a surface of the silicon substrate to form a crystal defect layer.
Public/Granted literature
- US20170069586A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ANTENNA SWITCH MODULE Public/Granted day:2017-03-09
Information query
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