Invention Grant
- Patent Title: Semiconductor device including buried gate structure and method for fabricating the same
-
Application No.: US15857016Application Date: 2017-12-28
-
Publication No.: US10553590B2Publication Date: 2020-02-04
- Inventor: Dong-Soo Kim
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2017-0065959 20170529
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/762 ; H01L29/51 ; H01L21/3213 ; H01L21/3215 ; H01L21/28 ; H01L29/49 ; H01L21/3105

Abstract:
A semiconductor device includes: a gate trench formed into a semiconductor substrate; a gate dielectric layer formed in the gate trench to cover an inside surface of the gate trench; and a gate electrode disposed over the gate dielectric layer to fill the gate trench, wherein the gate electrode includes: second crystal grains formed in the gate trench; and first crystal grains disposed between the second crystal grains and the gate dielectric layer and having a smaller crystal grain size than the second crystal grains.
Public/Granted literature
- US20180342518A1 SEMICONDUCTOR DEVICE INCLUDING BURIED GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2018-11-29
Information query
IPC分类: