Invention Grant
- Patent Title: Image sensor with a high absorption layer
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Application No.: US16127322Application Date: 2018-09-11
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Publication No.: US10553628B2Publication Date: 2020-02-04
- Inventor: Chien-Chang Huang , Chien Nan Tu , Ming-Chi Wu , Yu-Lung Yeh , Ji Heng Jiang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/0352 ; H01L31/028 ; H01L31/0236 ; H01L31/102

Abstract:
An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.
Public/Granted literature
- US20190027517A1 IMAGE SENSOR WITH A HIGH ABSORPTION LAYER Public/Granted day:2019-01-24
Information query
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