Invention Grant
- Patent Title: Resistive memory device by substrate reduction
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Application No.: US16017811Application Date: 2018-06-25
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Publication No.: US10553645B2Publication Date: 2020-02-04
- Inventor: Daniel Bedau
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, LLP
- Agent Steven H. Versteeg
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00 ; H01L23/528

Abstract:
To provide enhanced data storage devices and systems, various systems, architectures, apparatuses, and methods, are provided herein. In a first example, a resistive memory device is provided. The resistive memory device comprises a substrate, and an active region having resistance properties that can be modified to store one or more data bits, the active region comprising region of the substrate with a chemically altered reduction level to establish a resistive memory property in the substrate. The resistive memory device comprises terminals formed into the substrate and configured to couple the active region to associated electrical contacts.
Public/Granted literature
- US20180308900A1 RESISTIVE MEMORY DEVICE BY SUBSTRATE REDUCTION Public/Granted day:2018-10-25
Information query
IPC分类: