Invention Grant
- Patent Title: Trench double layer heterostructure
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Application No.: US15728417Application Date: 2017-10-09
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Publication No.: US10553735B2Publication Date: 2020-02-04
- Inventor: Majid Zandian
- Applicant: Teledyne Scientific & Imaging, LLC
- Applicant Address: US CA Thousand Oaks
- Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
- Current Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
- Current Assignee Address: US CA Thousand Oaks
- Agency: Snell & Wilmer LLP
- Main IPC: H01L31/0352
- IPC: H01L31/0352 ; H01L31/0216 ; H01L31/0296 ; H01L31/0336 ; H01L31/18 ; H01L31/103 ; G01J1/42

Abstract:
A light sensor includes an N-type semiconductor. The light sensor further includes a P-type semiconductor stacked on at least a portion of the N-type semiconductor, partially defining a trench extending into the P-type semiconductor, and having a trench portion aligned with the trench and extending farther into the N-type semiconductor than other portions of the P-type semiconductor. The light sensor also includes a passivation layer stacked on and contacting the P-type semiconductor and partially defining the trench that extends through the passivation layer and into the P-type semiconductor. The light sensor further includes an electrical contact stacked on the passivation layer, positioned within the trench, and extending through the passivation layer into the P-type semiconductor such that photons received by the N-type semiconductor generate photocurrent resulting in a voltage at the electrical contact.
Public/Granted literature
- US20190109247A1 TRENCH DOUBLE LAYER HETEROSTRUCTURE Public/Granted day:2019-04-11
Information query
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