Invention Grant
- Patent Title: Encapsulation structure, manufacturing method thereof and display apparatus
-
Application No.: US15764987Application Date: 2017-09-12
-
Publication No.: US10553825B2Publication Date: 2020-02-04
- Inventor: Ping Song , Feifei Wang , Youwei Wang , Peng Cai , Jing Yang
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Fay Sharpe LLP
- Priority: CN201710178739 20170323
- International Application: PCT/CN2017/101419 WO 20170912
- International Announcement: WO2018/171127 WO 20180927
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L51/00 ; C09D133/08 ; C09D133/26 ; C09D125/04 ; C09D133/10 ; H01L27/32
Abstract:
An encapsulation structure, a manufacturing method thereof and a display apparatus are provided in the field of display device encapsulation. The encapsulation structure includes a plurality of film layers coated on the outside of a display device and the plurality of film layers include an inorganic layer and an organic layer that are laminated. The organic layer includes a polymer matrix and a repairing microstructure.
Public/Granted literature
- US20190058161A1 ENCAPSULATION STRUCTURE, MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS Public/Granted day:2019-02-21
Information query
IPC分类:
