A method for manufacturing a vapor deposition mask includes providing a substrate including a plastic film. An electrostatic protection film is placed on a surface of the plastic film. The substrate combined with the electrostatic protection film is fixed on a frame and tension applied. The plastic film is etched to form at least one opening in the plastic film and the electrostatic protection film is removed, leaving a vapor deposition mask. The manufacturing method prevents movement during manufacture and moisture and scratches during vapor deposition, and particles (debris) or otherwise during etching are non-existent.