Invention Grant
- Patent Title: Conductor module
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Application No.: US16048554Application Date: 2018-07-30
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Publication No.: US10553917B2Publication Date: 2020-02-04
- Inventor: Takao Ota , Kazuya Harakawa
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2017-151366 20170804
- Main IPC: H01M10/48
- IPC: H01M10/48 ; H01R12/59 ; H05K1/02 ; H01M10/42 ; H01M2/20 ; H01R12/69 ; H01R4/30 ; H05K1/18 ; H01R11/28

Abstract:
A conductor module includes a wiring member, a plurality of bus bars, and a plurality of locking pieces. The wiring member is formed in a film shape with flexibility, and a plurality of wirings and through-holes are formed therein. The bus bar is electrically connected to one of two electrode terminals. The two through-holes are formed in a first opposing region opposing one end face between both end faces of the bus bar opposing each other in a width direction of the bus bar with an electrical connection portion where the bus bar and the wiring are electrically connected interposed therebetween when viewed from the width direction. The locking piece is formed integrally with the bus bar, is arranged in the through-hole, has a distal end positioned radially outward of the through-hole when viewed from an axial direction of the through-hole, and fixes the bus bar to the wiring member.
Public/Granted literature
- US20190044197A1 CONDUCTOR MODULE Public/Granted day:2019-02-07
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