Invention Grant
- Patent Title: Window assembly with solderless electrical connector
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Application No.: US16531915Application Date: 2019-08-05
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Publication No.: US10553964B2Publication Date: 2020-02-04
- Inventor: Daniel Bennett , Christopher A. Imeson
- Applicant: AGC Automotive Americas R&D, Inc.
- Applicant Address: US MI Ypsilanti
- Assignee: AGC Automotive Americas R&D, Inc.
- Current Assignee: AGC Automotive Americas R&D, Inc.
- Current Assignee Address: US MI Ypsilanti
- Agency: Quinn IP Law
- Main IPC: H01R4/28
- IPC: H01R4/28 ; H01R13/24 ; H01R13/187 ; H01R4/64 ; H01R13/11 ; H05K1/02 ; B60J1/00 ; H05B3/84 ; H05B3/86

Abstract:
A window assembly includes a transparent substrate, an electrical conductor provided on a surface of the substrate, and a solderless electrical connector for energizing the electrical conductor. The solderless electrical connector includes a cover adhered to the substrate to define a hollow volume, and a biasing member disposed within the hollow volume and elastically compressed between the cover and the electrical conductor. The biasing member further being electrically conductive and in electrical communication with the electrical conductor.
Public/Granted literature
- US20190356063A1 WINDOW ASSEMBLY WITH SOLDERLESS ELECTRICAL CONNECTOR Public/Granted day:2019-11-21
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