Invention Grant
- Patent Title: Connector housing with a reduced warpage
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Application No.: US16031324Application Date: 2018-07-10
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Publication No.: US10553983B2Publication Date: 2020-02-04
- Inventor: Yusuke Mito , Takayuki Naito , Akinobu Murakami
- Applicant: Tyco Electronics Japan G.K. , Toyota Jidosha Kabushiki Kaisha
- Applicant Address: JP Kanagawa JP Aichi-ken
- Assignee: Tyco Electronics Japan G.K.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Tyco Electronics Japan G.K.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Kanagawa JP Aichi-ken
- Agency: Barley Snyder
- Priority: JP2016-006822 20160118
- Main IPC: H01R13/518
- IPC: H01R13/518 ; H01R13/514 ; H01R25/00

Abstract:
A connector housing comprises a mating portion including a plurality of mating hoods that are arranged in a width direction on a front side of the connector housing that is configured to be mated with a mating connector and a rear structure portion disposed posterior to the mating portion. The rear structure portion includes a plurality of structure parts each disposed between two mating hoods adjacent to each other of the plurality of mating hoods and a plurality of notches each disposed between two structure parts adjacent to each other of the plurality of structure parts.
Public/Granted literature
- US20180323533A1 Connector Housing Public/Granted day:2018-11-08
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