Invention Grant
- Patent Title: Acoustic wave device
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Application No.: US15983463Application Date: 2018-05-18
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Publication No.: US10554196B2Publication Date: 2020-02-04
- Inventor: Hideyuki Sekine
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2017-113692 20170608
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/60 ; H03H9/70 ; H03H9/205

Abstract:
An acoustic wave device includes: a substrate; a first piezoelectric thin film resonator including a first resonance region in which a first lower electrode and a first upper electrode sandwich a first piezoelectric film; a second piezoelectric thin film resonator including a second resonance region in which a second lower electrode and a second upper electrode sandwich a second piezoelectric film; and a wiring layer that is located from an upper surface of the first lower electrode in a first extraction region, in which the first lower electrode is extracted from the first resonance region, to an upper surface of the second upper electrode located in a second extraction region, in which the second upper electrode is extracted from the second resonance region, and has a film thickness on the first lower electrode greater than a film thickness of the second piezoelectric film.
Public/Granted literature
- US20180358952A1 ACOUSTIC WAVE DEVICE Public/Granted day:2018-12-13
Information query
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