A microphone and its manufacturing method, relating to semiconductor techniques. The microphone comprises a capacitor comprising of a back plate and a vibration film plate, with the vibration film plate comprising a plurality of holes. The holes in the vibration film plate provide a ventilation route for pressured air in the microphone, and thus reduce the pressure on the vibration film plate which otherwise is susceptible to damaged under high air pressure. This inventive concept improves a microphone's acoustic tolerance.