Invention Grant
- Patent Title: Component-embedded resin substrate and method for manufacturing same
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Application No.: US14041572Application Date: 2013-09-30
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Publication No.: US10555421B2Publication Date: 2020-02-04
- Inventor: Yoshihito Otsubo
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto-Fu
- Agency: Pearne & Gordon LLP
- Priority: JP2011-082069 20110401
- Main IPC: H05K3/28
- IPC: H05K3/28

Abstract:
A component-embedded resin substrate (1) includes a plurality of resin layers (2) made of a first resin and laminated on one another, and a component (3) arranged to be surrounded by each resin layer (2) in a first group (8) which is a group of two or more resin layers arranged successively in a thickness direction included in the plurality of resin layers (2). An auxiliary resin portion (9) made of a second resin different from the first resin is arranged to be in contact with and along at least one of surfaces of the component (3).
Public/Granted literature
- US20140030471A1 COMPONENT-EMBEDDED RESIN SUBSTRATE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2014-01-30
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