Invention Grant
- Patent Title: Method for controlling the assembly of a printed circuit board by riveting
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Application No.: US16062751Application Date: 2016-12-12
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Publication No.: US10555431B2Publication Date: 2020-02-04
- Inventor: Pierre Perales , Chantal Cron
- Applicant: Continental Automotive France , Continental Automotive GmbH
- Applicant Address: FR Toulouse DE Hannover
- Assignee: Continental Automotive France,Continental Automotive GmbH
- Current Assignee: Continental Automotive France,Continental Automotive GmbH
- Current Assignee Address: FR Toulouse DE Hannover
- Agency: RatnerPrestia
- Priority: FR1562732 20151218
- International Application: PCT/EP2016/002095 WO 20161212
- International Announcement: WO2017/102075 WO 20170622
- Main IPC: B60R16/02
- IPC: B60R16/02 ; H05K7/14 ; H05K1/02

Abstract:
A method for mounting a printed circuit board for an automotive vehicle on a carrier structure including at least one rivet. The printed circuit board includes at least one mounting aperture that is capable of accommodating the rivet and which defines an electrical conduction zone and at least one mark having a control end up to which the mark extends over the electrical conduction zone. The method includes a step of positioning the printed circuit board on the carrier structure such that the rivet extends through the mounting aperture, a step of riveting the rivet such that its head is at least partly flattened on the electrical conduction zone and a step of determining the conformity of riveting when the head of the rivet covers the control end of the mark.
Public/Granted literature
- US20190343014A1 METHOD FOR CONTROLLING THE ASSEMBLY OF A PRINTED CIRCUIT BOARD BY RIVETING Public/Granted day:2019-11-07
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