Invention Grant
- Patent Title: Seamless back buckle with concealed fittings
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Application No.: US16250169Application Date: 2019-01-17
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Publication No.: US10555573B2Publication Date: 2020-02-11
- Inventor: Sek Ho Yip , Wenyong Yan
- Applicant: Sek Ho Yip , Wenyong Yan
- Agency: Maier & Maier, PLLC
- Priority: CN201820539780U 20180416
- Main IPC: A41F1/00
- IPC: A41F1/00 ; A44B13/00

Abstract:
A seamless back buckle with concealed fittings, including a substrate and a plurality of rows of fittings disposed on the substrate; wherein the substrate includes a surface layer and a bottom layer, an interlayer is disposed between the surface layer and the bottom layer, and the plurality of rows of fittings are disposed in the interlayer; and a through hole is formed at a position corresponding to each fitting on the surface layer, and each through hole is communicated with an interior of the interlayer. A new concealed structure is adopted for the fittings of the back buckle, which provides a new idea for the underwear market, and can effectively simplify production procedures and reduce production costs.
Public/Granted literature
- US20190313721A1 SEAMLESS BACK BUCKLE WITH CONCEALED FITTINGS Public/Granted day:2019-10-17
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