A plasma cutting apparatus includes a housing, a workpiece support, a movable plasma nozzle, and a nozzle drive arrangement. The housing includes a base, an upright pedestal extending upward from the base, and a stationary head cantilevered from the upright pedestal. The workpiece support extends from the upright pedestal and is located below the stationary head. The nozzle extends downward from an underside of the stationary head and is oriented for delivering a cutting plasma generally along one direction and toward a workpiece on the workpiece support. The nozzle drive arrangement is mounted to the stationary head and is connected for moving the plasma nozzle during a cutting operation.