• Patent Title: Method for the full-surface connection of antiparallel contact surfaces of a first and a second joining partner by means of a blank
  • Application No.: US15924954
    Application Date: 2018-03-19
  • Publication No.: US10556414B2
    Publication Date: 2020-02-11
  • Inventor: Michael Martin
  • Applicant: PREH GMBH
  • Applicant Address: DE Bad Neustadt A. D. Saale
  • Assignee: PREH GMBH
  • Current Assignee: PREH GMBH
  • Current Assignee Address: DE Bad Neustadt A. D. Saale
  • Agency: M&B IP Analysts, LLC
  • Priority: DE102017105935 20170320
  • Main IPC: B32B37/12
  • IPC: B32B37/12 H05K5/00
Method for the full-surface connection of antiparallel contact surfaces of a first and a second joining partner by means of a blank
Abstract:
The present disclosure relates to a method for the full-surface connection of contact surfaces, which form a cavity between them and extend in an antiparallel manner, of a first, transparent joining partner and a second joining partner, comprising the steps of: providing and arranging the first joining partner, the second joining partner and a blank made of an elastic material, such that the blank is disposed in the cavity formed between the contact surfaces extending in an antiparallel manner, and wherein the blank has an outer adhesive layer; heating the blank by irradiation with microwave radiation and/or infrared radiation (IR); curing or cross-linking the adhesive layer of the blank in order to form a layer structure of the first joining partner, the blank and the second joining partner.
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