Invention Grant
- Patent Title: Thermal transfer sheet
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Application No.: US15750551Application Date: 2017-03-30
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Publication No.: US10556457B2Publication Date: 2020-02-11
- Inventor: Yusaku Akiyama , Kazuki Enokida
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Shinjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shinjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2016-072154 20160331
- International Application: PCT/JP2017/013309 WO 20170330
- International Announcement: WO2017/170891 WO 20171005
- Main IPC: B41M3/12
- IPC: B41M3/12 ; B44C1/17 ; B41M7/00 ; B41M5/382 ; B32B7/06 ; B32B27/08

Abstract:
The present invention provides a thermal transfer sheet including at least a transfer layer and a substrate. The transfer layer includes at least a protective layer adapted to be peelable from the substrate, and the transfer layer has a peel force in a non-heated state of 1 N/m or more and a peel force in a heated state of 10 N/m or less. The thermal transfer sheet exhibits a high level of adhesion therebetween, even when used in a compact printer that causes the thermal transfer sheet to be heated by the heat of a thermal head. The transfer layer exhibits a high level of releasability when being transferred.
Public/Granted literature
- US20180272780A1 THERMAL TRANSFER SHEET Public/Granted day:2018-09-27
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