Invention Grant
- Patent Title: Accumulating/receiving device and heat pump system
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Application No.: US15448655Application Date: 2017-03-03
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Publication No.: US10556487B2Publication Date: 2020-02-11
- Inventor: Zhiwei Shan
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Main IPC: B60H1/00
- IPC: B60H1/00 ; F25B40/00 ; F25B5/02 ; F25B5/04 ; B60H1/32

Abstract:
The present disclosure provides an accumulating/receiving device for a heat pump system. The accumulating/receiving device includes a body, an inlet, a first outlet, and a second outlet. The body defines therein a space. The body is disposed downstream of an outside heat exchanger. The inlet is connected to the outside heat exchanger through a first conduit. The first outlet is connected to an inside heat exchanger through a second conduit. The second outlet is connected, through a bypass conduit, to a third conduit. A liquid of the refrigerant flows out of the body through the first outlet in a cooling mode. A vapor of the refrigerant flows out of the body through the second outlet in a heating mode.
Public/Granted literature
- US20170267063A1 ACCUMULATING/RECEIVING DEVICE AND HEAT PUMP SYSTEM Public/Granted day:2017-09-21
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