Invention Grant
- Patent Title: Buffer material
-
Application No.: US15920627Application Date: 2018-03-14
-
Publication No.: US10556733B2Publication Date: 2020-02-11
- Inventor: Masakazu Takeuchi
- Applicant: KYOCERA Document Solutions Inc.
- Applicant Address: JP Osaka
- Assignee: KYOCERA DOCUMENT SOLUTIONS INC.
- Current Assignee: KYOCERA DOCUMENT SOLUTIONS INC.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2017-055002 20170321
- Main IPC: B65D5/50
- IPC: B65D5/50 ; B65D81/133

Abstract:
A buffer material includes a pair of impact absorption parts. Each of the pair of impact absorption parts has a first rectangular plate part, which is formed by cutting a predetermined place of the sheet material and is bendable downward along one end edge, and a second rectangular plate part which is concatenated to the other end edge of the first rectangular plate part and has a length in a direction along the other end edge, which is longer than a length in the direction of the first rectangular plate part. Each of the pair of impact absorption parts is formed by bending the first rectangular plate part in a sectional V shape and allowing both end portions of the second rectangular plate part in the direction along the other end edge to be engaged with and held to an upper surface of the support plate part.
Public/Granted literature
- US20180273273A1 BUFFER MATERIAL Public/Granted day:2018-09-27
Information query
IPC分类: