Invention Grant
- Patent Title: Laser resealing with stress-reducing prestructuring
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Application No.: US15297794Application Date: 2016-10-19
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Publication No.: US10556789B2Publication Date: 2020-02-11
- Inventor: Frank Reichenbach , Jochen Reinmuth , Philip Kappe , Mawuli Ametowobla
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Norton Rose Fulbright US LLP
- Agent Gerard Messina
- Priority: DE102015220886 20151026
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/02 ; C03B23/20 ; C03C23/00

Abstract:
A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity: in a first method step, an access opening, connecting the first cavity to surroundings of the micromechanical component, being formed in the substrate or in the cap; in a second method step, the first pressure and/or the first chemical composition being adjusted in the first cavity; in a third method step, the access opening being sealed by introducing energy and heat into an absorbing part of the substrate or the cap with the aid of a laser; in a fourth method step, a recess being formed, and/or an elevation being formed, and/or a reflection area being formed, and/or an absorption area being formed.
Public/Granted literature
- US20170113923A1 LASER RESEALING WITH STRESS-REDUCING PRESTRUCTURING Public/Granted day:2017-04-27
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