Invention Grant
- Patent Title: Cutters comprising polycrystalline diamond attached to a hard metal carbide substrate
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Application No.: US15514429Application Date: 2015-09-25
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Publication No.: US10556832B2Publication Date: 2020-02-11
- Inventor: Hui Zhang , Abhijit Suryavanshi , Alexander Hirsch , Kai Zhang
- Applicant: DIAMOND INNOVATIONS, INC.
- Applicant Address: US OH Worthington
- Assignee: DIAMOND INNOVATIONS, INC.
- Current Assignee: DIAMOND INNOVATIONS, INC.
- Current Assignee Address: US OH Worthington
- International Application: PCT/US2015/052215 WO 20150925
- International Announcement: WO2016/049452 WO 20160331
- Main IPC: C04B37/00
- IPC: C04B37/00 ; B22F3/14 ; B22F7/06 ; C22C26/00 ; C22C29/08 ; B24D18/00 ; C04B35/528 ; C04B35/56 ; C04B35/645 ; E21B10/573

Abstract:
Superabrasive compacts and methods of making superabrasive compacts are disclosed. A superabrasive compact includes a polycrystalline diamond table and a substrate attached to the polycrystalline diamond table. The substrate includes a hard metal carbide and a binder having a compound with a composition of AxByCz, where A and B are transition metals, where C is carbon, and where 0≤x≤7, 0≤y≤7, x+y=7, and 0≤z≤3.
Public/Granted literature
- US20170297960A1 CUTTERS COMPRISING POLYCRYSTALLINE DIAMOND ATTACHED TO A HARD METAL CARBIDE SUBSTRATE Public/Granted day:2017-10-19
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