Invention Grant
- Patent Title: Film-forming ink, film formation method, device with film, and electronic apparatus
-
Application No.: US15531904Application Date: 2015-11-30
-
Publication No.: US10557046B2Publication Date: 2020-02-11
- Inventor: Takuya Sonoyama , Koji Imamura , Shotaro Watanabe
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2014-244520 20141202
- International Application: PCT/JP2015/005948 WO 20151130
- International Announcement: WO2016/088352 WO 20160609
- Main IPC: C09D11/03
- IPC: C09D11/03 ; C09D11/50 ; C09D11/106 ; C09D11/36 ; C09D11/38 ; C09D11/52 ; H01L51/00 ; G02B5/20 ; C09D11/033 ; H05B33/22 ; H01L51/50 ; H05B33/10 ; B05D7/24 ; H05B33/12 ; C09D11/102 ; C09D11/30 ; C23C14/06 ; H01L27/32 ; H01L51/56

Abstract:
To provide a film-forming ink and a film formation method, capable of making the dimensional accuracy of a film to be formed excellent by increasing the apparent liquid droplet amount of a film-forming ink to be supplied as a liquid droplet into an opening part included in a partition wall, and also to provide a device with a film and an electronic apparatus, each of which has a film formed using the film formation method. A film-forming ink of the invention includes a film-forming material and a liquid medium in which the film-forming material is dissolved or dispersed, wherein the liquid medium contains a first component which has a boiling point at an atmospheric pressure of 200° C. or higher and a second component which has a boiling point at an atmospheric pressure lower than the first component.
Public/Granted literature
- US20170267880A1 FILM-FORMING INK, FILM FORMATION METHOD, DEVICE WITH FILM, AND ELECTRONIC APPARATUS Public/Granted day:2017-09-21
Information query
IPC分类: