Invention Grant
- Patent Title: Plated material and terminal using this plated material
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Application No.: US15497557Application Date: 2017-04-26
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Publication No.: US10557204B2Publication Date: 2020-02-11
- Inventor: Yoshitaka Ito
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2016-088723 20160427
- Main IPC: B32B15/01
- IPC: B32B15/01 ; C23C18/31 ; H01R13/03 ; C25D5/12 ; C23C28/02 ; C23C18/16
Abstract:
A plated material includes a base metal made from Cu or an alloy containing Cu as a main raw material, an underlayer made from Ni formed on the base metal, and an Ag plated layer formed on the underlayer. A thickness of the underlayer is 0.1 μm to 1.0 μm. A thickness of the Ag plated layer is 1.0 μm or less.
Public/Granted literature
- US20170314135A1 PLATED MATERIAL AND TERMINAL USING THIS PLATED MATERIAL Public/Granted day:2017-11-02
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