Invention Grant
- Patent Title: Thermally conductive and vibration damping electronic device enclosure and mounting
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Application No.: US16132517Application Date: 2018-09-17
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Publication No.: US10558247B2Publication Date: 2020-02-11
- Inventor: David Lane Smith
- Applicant: David Lane Smith
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; G06F1/18 ; G11B33/14 ; G11B33/08 ; G06F1/20 ; H05K7/20 ; G11B33/12
Abstract:
A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.
Public/Granted literature
- US20190025893A1 THERMALLY CONDUCTIVE AND VIBRATION DAMPING ELECTRONIC DEVICE ENCLOSURE AND MOUNTING Public/Granted day:2019-01-24
Information query
