Invention Grant
- Patent Title: Emotion heat mapping
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Application No.: US15870812Application Date: 2018-01-12
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Publication No.: US10558862B2Publication Date: 2020-02-11
- Inventor: Addicam V. Sanjay , Shao-Wen Yang , Siew Wen Chin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06T11/20
- IPC: G06T11/20 ; G06K9/00 ; G10L25/63

Abstract:
Localization data is accessed, which is based on information collected by one or more sensor devices deployed within an environment. The localization data identifies presence of a person within a particular location within the environment. A feature vector is access, which includes values to describe a plurality of different physical characteristics of the person as measured by a set of one or more sensor devices deployed within the environment when the person was present within the particular location. An emotion of the person is determined from the feature vector data, and the emotion is associated with the particular location within the environment. An emotion heat map is generated of the environment to map emotional responses determined within the environment to specific locations within the environment.
Public/Granted literature
- US20190042854A1 EMOTION HEAT MAPPING Public/Granted day:2019-02-07
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