Invention Grant
- Patent Title: Process for producing electrical wire molded body
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Application No.: US14124830Application Date: 2012-05-01
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Publication No.: US10559407B2Publication Date: 2020-02-11
- Inventor: Shinichi Kishimoto , Shinichi Saito , Hideo Ohsawa
- Applicant: Shinichi Kishimoto , Shinichi Saito , Hideo Ohsawa
- Applicant Address: JP Tokyo
- Assignee: Riken Technos Corporation
- Current Assignee: Riken Technos Corporation
- Current Assignee Address: JP Tokyo
- Agency: Nutter McClennen & Fish LLP
- Priority: JP2011-128583 20110608
- International Application: PCT/JP2012/061548 WO 20120501
- International Announcement: WO2012/169298 WO 20121213
- Main IPC: H01B13/00
- IPC: H01B13/00 ; H01B13/14 ; H01B3/44 ; B05D7/20 ; B05D1/26 ; C23C2/38

Abstract:
There are provided a process for producing an electrical wire molded body comprising: step I of melting and kneading a polyethylene-based resin (a), a polypropylene-based resin (b), a block copolymer (c) of an aromatic vinyl-based compound and a conjugated diene-based compound and the like, and a silane coupling agent (g), and other components, to produce a silane crosslinkable flame retardant polyolefin (A); step II of melting and kneading a polymer selected from the components (a) to (c) and a silanol condensation catalyst (i), to produce a silanol catalyst rein composition (B); and step III of mixing the components (A) and (B), melt molding the mixture on a conductor and then crosslinking the molded body in the presence of water.
Public/Granted literature
- US20140227518A1 PROCESS FOR PRODUCING ELECTRICAL WIRE MOLDED BODY Public/Granted day:2014-08-14
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