Invention Grant
- Patent Title: Multilayer capacitor and board having the same
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Application No.: US16270745Application Date: 2019-02-08
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Publication No.: US10559425B2Publication Date: 2020-02-11
- Inventor: Jong Pil Lee , Hyo Youn Lee , Sung Kwon An , Seung Woo Song , Taek Jung Lee , Jin Kyung Joo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0113802 20170906
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/232 ; H01G4/248 ; H01G4/30 ; H01K1/18 ; H05K1/18 ; H01G2/06 ; H01G4/12 ; H05K1/11

Abstract:
A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
Public/Granted literature
- US20190172645A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2019-06-06
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