- Patent Title: Method for manufacturing electronic device and electronic device
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Application No.: US15757832Application Date: 2016-12-26
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Publication No.: US10559478B2Publication Date: 2020-02-11
- Inventor: Hideki Kamada
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2016/088619 WO 20161226
- International Announcement: WO2018/122894 WO 20180705
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; B29C39/10 ; H01L23/40 ; H01L23/31 ; H01L23/29 ; H01L23/544 ; H01L23/16 ; B29K705/00 ; B29L31/34 ; H01L25/065 ; H01L23/367
Abstract:
Manufacturing method for an electronic device comprises a step of placing a substrate 10, which has a metal plate 11 on a back-surface side, on a back-surface-side mold 110 having a mold recessed part 111, a step of placing a front-surface-side mold 120 on the back-surface-side mold so as to cover the substrate 10; and a step of pouring resin between the front-surface mold 100 and the back-surface-side mold 110, when the substrate 10 is pressed against the back-surface-side mold 110. Circumferential part of the metal plate 11 is in contact with an edge of the mold recessed part 111 when the substrate 10 is pressed against the back-surface-side mold 110 in the step of pouring resin.
Public/Granted literature
- US20180342406A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE Public/Granted day:2018-11-29
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