Invention Grant
- Patent Title: Techniques for filling a structure using selective surface modification
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Application No.: US15904020Application Date: 2018-02-23
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Publication No.: US10559496B2Publication Date: 2020-02-11
- Inventor: Kurtis Leschkies , Steven Verhaverbeke
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/44 ; H01L21/768 ; C23C16/02 ; C23C16/04 ; C23C16/455 ; H01L21/285 ; H01L21/02 ; C23C16/48 ; C23C16/50 ; C23C16/52 ; C23C16/56 ; H01L21/67 ; H01L21/32 ; H01L21/3105
Abstract:
A method of device processing. The method may include providing a cavity in a layer, directing energetic flux to a bottom surface of the cavity, performing an exposure of the cavity to a moisture-containing ambient, and introducing a fill material in the cavity using an atomic layer deposition (ALD) process, wherein the fill material is selectively deposited on the bottom surface of the cavity with respect to a sidewall of the cavity.
Public/Granted literature
- US20180218943A1 TECHNIQUES FOR FILLING A STRUCTURE USING SELECTRIVE SURFACE MODIFICATION Public/Granted day:2018-08-02
Information query
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