Invention Grant
- Patent Title: High mobility semiconductor fins on insulator
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Application No.: US15900479Application Date: 2018-02-20
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Publication No.: US10559504B2Publication Date: 2020-02-11
- Inventor: Kangguo Cheng , Xin Miao , Wenyu Xu , Chen Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent L. Jeffrey Kelly
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L27/12 ; H01L21/02 ; H01L21/762 ; H01L29/06

Abstract:
High-mobility semiconductor fins are formed on an insulator layer using techniques allowing precise control of fin heights. Lattice-matched fins are grown epitaxially on sidewalls of an essentially defect-free portion of a semiconductor template. The fins are formed within laterally extending trenches in a top dielectric layer, the thickness of which determines fin height. The trenches extend orthogonally to the template. Epitaxial overgrowth above the top dielectric layer is removed by planarization. The fin template and top dielectric layer are removed, leaving sets of parallel fins on the insulator layer. The fin template can be replaced by an isolation region for electrically isolating sets of fins.
Public/Granted literature
- US20190259672A1 HIGH MOBILITY SEMICONDUCTOR FINS ON INSULATOR Public/Granted day:2019-08-22
Information query
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