Invention Grant
- Patent Title: Series circuit arrangement of power semiconductors
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Application No.: US16075761Application Date: 2017-01-13
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Publication No.: US10559519B2Publication Date: 2020-02-11
- Inventor: Johann Holweg , Katrin Benkert , Harald Landes , André Leonide
- Applicant: Siemens Aktiengesellschaft
- Applicant Address: DE Munich
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE Munich
- Agency: Slayden Grubert Beard PLLC
- Priority: DE102016201679 20160204; DE102016202748 20160223
- International Application: PCT/EP2017/050680 WO 20170113
- International Announcement: WO2017/133881 WO 20170810
- Main IPC: G12B15/02
- IPC: G12B15/02 ; H02M5/45 ; H02M7/515 ; H02M7/537 ; H05K7/20 ; H01L23/473 ; H01L23/367 ; H02M7/53854 ; F28F27/02 ; H02M5/44

Abstract:
The present disclosure relates to semiconductors. Some embodiments may include a series circuit arrangement of power semiconductors comprising: cooling-water boxes arranged on the semiconductors and electrically connected to them; two cooling-water distributor lines; respective branchings on the cooling-water distributor lines for the cooling chambers; and a control electrode arranged on the cooling-water distributor lines. The cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream. The cooling chambers are connected to the branchings via a respective connecting line. For at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.
Public/Granted literature
- US20190043784A1 Series Circuit Arrangement of Power Semiconductors Public/Granted day:2019-02-07
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