Invention Grant
- Patent Title: Power module
-
Application No.: US15533870Application Date: 2016-02-09
-
Publication No.: US10559538B2Publication Date: 2020-02-11
- Inventor: Junji Fujino , Shohei Ogawa , Soichi Sakamoto
- Applicant: MITSUBISHI ELECTRIC CORPORATON
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2015-034734 20150225
- International Application: PCT/JP2016/053779 WO 20160209
- International Announcement: WO2016/136457 WO 20160901
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/31 ; H01L23/367 ; H01L23/00 ; H01L25/18

Abstract:
A power module of the invention includes a power semiconductor element mounted on a circuit board, and an adapter connected to a front-surface main electrode of the element, wherein the adapter includes a main-electrode wiring member which is connected to the front-surface main electrode of the element; and wherein the main-electrode wiring member includes: an element connection portion connected to the front-surface main electrode of the element; a board connection portion which is placed outside the element connection portion and connected to the circuit board; and a connector connection portion which is placed outside the element connection portion and connected to an external electrode through a connector.
Public/Granted literature
- US20170338190A1 POWER MODULE Public/Granted day:2017-11-23
Information query
IPC分类: