There is disclosed a package comprising at least an integrated circuit embedded in an electrically non-conductive moulded material. The moulded material includes at least one moulded pattern on at least one surface thereof, and at least one electrically conductive track in the pattern. There is further provided at least one capacitive, inductive or galvanic component electrically connecting between at least two parts of the at least one electrically conductive track. The conductive track can be configured as antenna, and the capacitive, inductive or galvanic component is used to adjust tuning and other characteristics of the antenna.