Invention Grant
- Patent Title: Non-volatile memory devices and methods of fabricating the same
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Application No.: US15914168Application Date: 2018-03-07
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Publication No.: US10559577B2Publication Date: 2020-02-11
- Inventor: Dong-kil Yun , Chan-ho Kim , Pan-suk Kwak , Hong-soo Jeon
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2017-0107407 20170824
- Main IPC: H01L27/11526
- IPC: H01L27/11526 ; H01L27/11529 ; H01L29/94 ; H01L27/11556 ; H01L27/112 ; H01L27/108 ; G11C16/08 ; G11C16/04 ; G11C11/56

Abstract:
A non-volatile memory device may include a first semiconductor layer including a peripheral region, the peripheral region including one or more peripheral transistors on a lower substrate. The non-volatile memory device may further include a second semiconductor layer on the peripheral region, the second semiconductor layer including an upper substrate, the second semiconductor layer further including a memory cell array on the upper substrate. The upper substrate may include a first upper substrate on the first semiconductor layer, a first layer on the first upper substrate, and a second upper substrate on the first layer.
Public/Granted literature
- US20190067308A1 NON-VOLATILE MEMORY DEVICES AND METHODS OF FABRICATING THE SAME Public/Granted day:2019-02-28
Information query
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