Invention Grant
- Patent Title: Imaging device and method of manufacturing imaging device
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Application No.: US15739230Application Date: 2017-01-11
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Publication No.: US10559619B2Publication Date: 2020-02-11
- Inventor: Masahiko Nakamizo
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2016-031074 20160222
- International Application: PCT/JP2017/000533 WO 20170111
- International Announcement: WO2017/145537 WO 20170831
- Main IPC: H04N5/369
- IPC: H04N5/369 ; H01L27/146 ; H04N5/374 ; H04N5/378 ; H04N5/357 ; H01L21/265 ; H01L23/00

Abstract:
To reduce the influence of noise in the imaging device configured with the plurality of semiconductor chips.A first semiconductor chip includes a signal input transistor in which an input signal which is a signal corresponding to incident light is input to a control terminal, a reference input transistor which forms a differential pair along with the signal input transistor and in which a reference signal is input to a control terminal, a first signal line which delivers a change in a current flowing in one of the signal input transistor and the reference input transistor as a result of comparison between the input signal and the reference signal when the current is changed in accordance with a difference between the input signal and the reference signal, and a first pad which is electrically connected to the first signal line. A second semiconductor chip includes a processing circuit which processes the result of the comparison, a second signal line which is electrically connected to the processing circuit and delivers the result of the comparison to the processing circuit, and a second pad which is electrically connected to the second signal line and the first pad.
Public/Granted literature
- US20180190703A1 IMAGING DEVICE AND METHOD OF MANUFACTURING IMAGING DEVICE Public/Granted day:2018-07-05
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