A semiconductor structure is provided that includes a semiconductor substrate including a first device region and a second device region. First trench isolation structures surround the first and second device regions and extend below first and second pedestal portions of the semiconductor substrate. A first semiconductor material fin stack is located above the first pedestal portion of the semiconductor substrate, and a second semiconductor material fin stack is located above the second pedestal portion of the semiconductor substrate. Second trench isolation structures are located at ends of each first and second semiconductor material fin stacks. A portion of each second trench isolation structure is located directly between a bottommost surface of the first or second semiconductor material fin stack and the first or second pedestal portion of the semiconductor substrate.