Invention Grant
- Patent Title: Vertical transport field-effect transistor including air-gap top spacer
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Application No.: US16404704Application Date: 2019-05-06
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Publication No.: US10559671B2Publication Date: 2020-02-11
- Inventor: Hemanth Jagannathan , Choonghyun Lee , Alexander Reznicek , Christopher Waskiewicz
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Wallace & Kammer, LLP
- Agent L. Jeffrey Kelly
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/78

Abstract:
A vertical transport field-effect transistor includes a top source/drain region separated from an underlying gate stack by a top spacer including open gaps to reduce capacitance therebetween. Techniques for fabricating the transistor include using a sacrificial spacer that is selectively removed prior to growth of the top source/drain region. The top source/drain region may be confined by opposing dielectric layers.
Public/Granted literature
- US20190259854A1 VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR INCLUDING AIR-GAP TOP SPACER Public/Granted day:2019-08-22
Information query
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