Invention Grant
- Patent Title: Semiconductor apparatus and semiconductor apparatus manufacturing method
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Application No.: US16001937Application Date: 2018-06-07
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Publication No.: US10559682B2Publication Date: 2020-02-11
- Inventor: Tatsuya Naito
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2017-118171 20170615
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/78 ; H01L29/66 ; H01L29/861 ; H01L29/08 ; H01L29/10 ; H01L29/417

Abstract:
To provide a semiconductor apparatus including: a semiconductor substrate having a drift region; an emitter region provided inside the semiconductor substrate and above the drift region; a base region provided between the emitter and drift regions; an accumulation region provided between the base and drift regions; and a plurality of gate trench portions provided to penetrate the accumulation region from an upper surface of the semiconductor substrate. The base region has: a low concentration base region provided in contact with the gate trench portions; and a high concentration base region provided apart from the gate trench portions and having a doping concentration higher than the low concentration base region. The high concentration base region is provided below the emitter region, and a width of the high concentration base region in a depth direction of the semiconductor substrate is larger than 0.1 μm.
Public/Granted literature
- US20180366578A1 SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING METHOD Public/Granted day:2018-12-20
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