Invention Grant
- Patent Title: Hybrid CMOS device and manufacturing method thereof
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Application No.: US15744811Application Date: 2017-11-25
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Publication No.: US10559696B2Publication Date: 2020-02-11
- Inventor: Liangfen Zhang , Yuanjun Hsu , Jangsoon Im , Yuanchun Wu , Poyen Lu , Boru Yang , Changdong Chen , Chuan Liu
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Hemisphere Law, PLLC
- Agent Zhigang Ma
- Priority: CN201710943188 20171011
- International Application: PCT/CN2017/112969 WO 20171125
- International Announcement: WO2019/071750 WO 20190418
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L27/092 ; H01L21/8238

Abstract:
The disclosure provides a hybrid CMOS device and a manufacturing method thereof. The manufacturing method of the hybrid CMOS device according to the disclosure uses a low-temperature polysilicon to prepare an active layer of a PMOS transistor, and simultaneously uses a metal oxide semiconductor to prepare an active layer of an NMOS transistor. The two types of semiconductor materials are used in combination to form a hybrid CMOS device. Compared with the existing method for producing an active layer of the PMOS transistor by using a two-dimensional carbon nanotransister material or an organic semiconductor material, the hybrid CMOS device obtained according to the disclosure has superior electrical properties.
Public/Granted literature
- US20190109238A1 HYBRID CMOS DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-04-11
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