Invention Grant
- Patent Title: Semiconductor light emitting device and method for manufacturing same
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Application No.: US16082911Application Date: 2017-03-08
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Publication No.: US10559716B2Publication Date: 2020-02-11
- Inventor: Go Oike , Hiroshi Katsuno , Koji Kaga , Masakazu Sawano , Yuxiong Ren , Kazuyuki Miyabe
- Applicant: ALPAD CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: ALPAD CORPORATION
- Current Assignee: ALPAD CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2016-044327 20160308
- International Application: PCT/JP2017/009212 WO 20170308
- International Announcement: WO2017/154973 WO 20170914
- Main IPC: H01L33/22
- IPC: H01L33/22 ; H01L33/50 ; H01L33/54 ; H01L33/20 ; H01L33/00 ; H01L33/32

Abstract:
A semiconductor light emitting device according to an embodiment includes a stacked body. The stacked body includes a first semiconductor layer of a first conductivity type, a light emitting layer is provided on the first semiconductor layer, and a second semiconductor layer of a second conductivity type provided on the light emitting layer. The stacked body includes a first protrusion on an upper surface of the stacked body. The first protrusion protrudes in a first direction from the first semiconductor layer to the light emitting layer. Length of the first protrusion in a second direction perpendicular to the first direction decreases toward the first direction. The first protrusion includes a first portion and a second portion. The first portion has a first side surface inclined with respect to the first direction. The second portion is provided below the first portion and having a second side surface inclined with respect to the first direction. The second side surface is curved so as to be convex downward.
Public/Granted literature
- US20190088821A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2019-03-21
Information query
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