An electronic component includes a first module, a second module and a third module between the first module and the second module. Each of the first module and the second module includes a plurality of conductive pads thereon. A connecting part includes a plate body and a plurality of first tails and a plurality of second tails respectively extending on two opposite sides of the plate body wherein the first tails are soldered upon the first conductive pads and the second tails are soldered upon the second conductive pads, respectively. Each of the first tails and the second tails includes a mounting pad with a through hole therein, and a folded section on the end edge with a solder unit received with a space formed in the folded section and communicatively above the corresponding through hole.