A ruggedized electrical receptacle that has a shell configured to receive an interface of a mating connector and a contact subassembly received in the shell. The contact subassembly includes a contact printed circuit board, interface contacts coupled to one face of the contact printed circuit board, termination contacts coupled to the other face thereof, and an overmold overmolded on the board. The overmold surrounds the contact printed circuit board such that free ends of the interface contacts are exposed and tail ends of the termination contacts are exposed. An internal sealing member is disposed between an outer surface of the overmold and the inner surface of the shell, thereby creating a seal therebetween.