Invention Grant
- Patent Title: Interconnection system
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Application No.: US16373664Application Date: 2019-04-03
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Publication No.: US10559930B2Publication Date: 2020-02-11
- Inventor: Terrance F. Little
- Applicant: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. , FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Applicant Address: CN Kunshan KY Grand Cayman
- Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO. LTD,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO. LTD,FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Current Assignee Address: CN Kunshan KY Grand Cayman
- Agent Wei Te Chung; Ming Chieh Chang
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R13/659 ; H01R12/72 ; H01R12/71 ; H01R13/6582 ; H01R13/6594 ; H01R13/66 ; H01R13/6587

Abstract:
An electrical receptacle connector is mounted within a metallic cage for mating with a SFP module received within the cage. The contacts of the cable receptacle connector are arranged with two groups, of which one are connected to the printed circuit board on which the cage is mounted, and the other are connected to the wires which are further connected to a board-mount receptacle connector mounted on another printed circuit board on which the CPU (Central Processing Unit) socket is mounted. Each board-mount receptacle connector corresponds to more than one cable receptacle connector.
Public/Granted literature
- US20190312389A1 INTERCONNECTION SYSTEM Public/Granted day:2019-10-10
Information query