Invention Grant
- Patent Title: Electronic component
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Application No.: US15636704Application Date: 2017-06-29
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Publication No.: US10560066B2Publication Date: 2020-02-11
- Inventor: Kosuke Ishida
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Studebaker & Brackett PC
- Priority: JP2016-163568 20160824
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H01G4/232 ; H01G4/40 ; H01G2/06 ; H01F17/00 ; H01F27/29 ; B32B37/00 ; H01G4/30 ; H01L21/48 ; H01L23/50 ; H05K7/10 ; H01L23/498 ; H03H1/00

Abstract:
An electronic component capable of downsizing and narrowing of a mounting space. The electronic component includes: a laminated body made up of a plurality of laminated insulator layers and having an upper surface and a bottom surface; a plurality of inner conductors disposed in the laminated body; and a plurality of terminal electrodes electrically connected to the plurality of inner conductors and exposed from the laminated body. The electronic component has a plurality of recesses formed on a bottom surface of the laminated body. The plurality of terminal electrodes includes first conductive parts formed on wall surfaces of the plurality of recesses.
Public/Granted literature
- US20180061670A1 ELECTRONIC COMPONENT Public/Granted day:2018-03-01
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