Invention Grant
- Patent Title: Elastic wave apparatus
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Application No.: US16001000Application Date: 2018-06-06
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Publication No.: US10560069B2Publication Date: 2020-02-11
- Inventor: Tomoko Taguchi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2017-124027 20170626; JP2018-051016 20180319
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H03H9/70 ; H03H9/00 ; H03H9/05

Abstract:
An elastic wave apparatus includes a multilayer substrate, first through fourth band pass filters, an antenna terminal, and first and second inductors. The multilayer substrate includes first through sixth wiring layers. The first through fourth band pass filters are disposed on the multilayer substrate and are connected to a common node. The antenna terminal is connected to an antenna and also to the common node. The first inductor is connected to the antenna terminal. The second inductor is connected between the first band pass filter and the common node. The first inductor is disposed on the fourth and fifth wiring layers. The second inductor is disposed on the second and third wiring layers which are different from the fourth and fifth wiring layers. The first and second inductors overlap each other at least partially as viewed from above.
Public/Granted literature
- US20180375495A1 ELASTIC WAVE APPARATUS Public/Granted day:2018-12-27
Information query
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