Invention Grant
- Patent Title: Switch assembly of reactive power compensation apparatus
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Application No.: US16279480Application Date: 2019-02-19
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Publication No.: US10560091B2Publication Date: 2020-02-11
- Inventor: Teagsun Jung
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si, Gyeonggi-Do
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si, Gyeonggi-Do
- Agency: K&L Gates LLP
- Priority: KR10-2018-0037098 20180330
- Main IPC: G05F1/70
- IPC: G05F1/70 ; H03K17/687 ; H03K17/14 ; H02J3/18 ; H05K7/20 ; H02M7/00 ; H01L23/40 ; H01L25/11

Abstract:
A switch assembly of a reactive power compensation apparatus may include a first switching module having a first stack structure perpendicular to a supporting module, and a second switching module having a second stack structure perpendicular to the supporting module, the second switching module being connected in parallel with the first switching module. Each of the first and second switching modules may include a plurality of cooling plates stacked along a vertical direction with respect to the supporting module, and a plurality of switches disposed between the plurality of cooling plates. The cooling plate may include an engagement portion disposed on one side of the upper surface to be located at a normal position by guiding the switch.
Public/Granted literature
- US20190305771A1 SWITCH ASSEMBLY OF REACTIVE POWER COMPENSATION APPARATUS Public/Granted day:2019-10-03
Information query
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