Invention Grant
- Patent Title: Assembling method of camera module
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Application No.: US16044767Application Date: 2018-07-25
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Publication No.: US10560618B2Publication Date: 2020-02-11
- Inventor: Kuo-Ming Lai
- Applicant: Primax Electronics Ltd.
- Applicant Address: TW Taipei
- Assignee: PRIMAX ELECTRONICS LTD.
- Current Assignee: PRIMAX ELECTRONICS LTD.
- Current Assignee Address: TW Taipei
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: TW107115289A 20180504
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
An assembling method of a camera module includes the following steps. Firstly, a sensing chip is installed on a strip-like substrate. Then, the strip-like substrate is bent, so that a bent substrate in a bent state is formed. Then, the bent substrate and an optical lens are placed on a fastening table and an alignment module, respectively. Then, an installation angle of the optical lens is adjusted by the alignment module according to an active alignment. Then, the optical lens and the bent substrate are combined together. After the bent substrate is restored from the bent state to a non-bent state, the camera module is produced. The assembling method is suitable for assembling the longer camera module.
Public/Granted literature
- US20190342475A1 ASSEMBLING METHOD OF CAMERA MODULE Public/Granted day:2019-11-07
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