Invention Grant
- Patent Title: Transducer assembly
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Application No.: US15949014Application Date: 2018-04-09
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Publication No.: US10560793B2Publication Date: 2020-02-11
- Inventor: Richard Warren Little , Daniel Liu , Derrick Pierce , Ernie Latham-Brown
- Applicant: Sonos, Inc.
- Applicant Address: US CA Santa Barbara
- Assignee: Sonos, Inc.
- Current Assignee: Sonos, Inc.
- Current Assignee Address: US CA Santa Barbara
- Main IPC: H04R9/00
- IPC: H04R9/00 ; H04R31/00 ; H04R1/06 ; H04R9/06
Abstract:
A diaphragm for a loudspeaker may include a conductive coupler, a voice coil having a voice coil lead, where the voice coil lead is positioned in conductive contact with the conductive coupler, and a terminal lead, where the terminal lead is positioned in conductive contact with the conductive coupler, and where the voice coil lead and the terminal lead are attached to the conductive coupler.
Public/Granted literature
- US20180227689A1 Transducer Assembly Public/Granted day:2018-08-09
Information query
